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  july 2008 rev 8 1/11 11 stbv32 high voltage fast-switching npn power transistor features high voltage capability low spread of dynamic parameters minimum lot-to-lot spread for reliable operation very high switching speed applications compact fluorescent lamps (cfls) smps for battery charger description the device is manufactured using high voltage multi epitaxial planar technology for high switching speeds and high voltage capability. it uses a cellular emitter structure with planar edge termination to enhance switching speeds while maintaining the wide rbsoa. the STBV32G and STBV32G-ap are supplied using halogen-free molding compound. figure 1. internal schematic diagram to-92 to-92ap table 1. device summary order codes marking package packaging stbv32 bv32 to-92 bulk STBV32G bv32g to-92 bulk stbv32-ap bv32 to-92ap ammopack STBV32G-ap bv32g to-92ap ammopack www.st.com
electrical ratings stbv32 2/11 1 electrical ratings table 2. absolute maximum rating table 3. thermal data symbol parameter value unit v ces collector-emitter voltage (v be = 0) 700 v v ceo collector-emitter voltage (i b = 0) 400 v v ebo collector-base voltage (i c = 0, i b = 0.5a, t p < 10 ms) v (br)ebo v i c collector current (f 100 hz, duty-cycle 50%, t c = 25 c) 1.5 a i cm collector peak current (t p < 5 ms) 3 a i b base current 0.5 a i bm base peak current (t p < 5 ms) 1.5 a p tot total dissipation at t c = 25 c 1.5 w t stg storage temperature -65 to 150 c t j max. operating junction temperature 150 symbol parameter value unit r thj-case thermal resistance junction-case __________ max 83.3 c/w
stbv32 electrical characteristics 3/11 2 electrical characteristics (t case = 25 c; unless otherwise specified) table 4. electrical characteristics symbol parameter test conditions min. typ. max. unit i ces collector cut-off current (v be = 0) v ce = 700 v v ce = 700 v t c = 125 c 1 5 ma ma v (br)ebo emitter-base breakdown voltage (i c = 0) i e = 10 ma 9 18 v v ceo(sus) (1) 1. pulsed duration = 300 s, duty cycle 1.5% collector-emitter sustaining voltage (i b = 0) i c = 10 ma 400 v v ce(sat) (1) collector-emitter saturation voltage i c = 0.5 a i b = 100 ma i c = 1 a i b = 250 ma i c = 1.5 a i b = 500 ma 0.5 1 1.5 v v v v be(sat) (1) base-emitter saturation voltage i c = 0.5 a i b = 100 ma i c = 1 a i b = 250 ma 1 1.2 v v h fe dc current gain i c = 0.5 ma v ce = 2 v i c = 0.5 a v ce = 2 v i c = 1 a v ce = 2 v 20 8 5 25 25 t r t s t f resistive load rise time storage time fall time i c = 1 a ___ _ t p = 25 s i b1 = -i b2 = 200 ma v cc = 125 v figure 12. 1 4 0.7 s s s t s inductive load storage time i c = 1 a v clamp = 300 v i b1 = 200 ma v be(off) = -5 v l = 50 mh r bb = 0 figure 13. 0.8 s
electrical characteristics stbv32 4/11 2.1 electrical characteristics (curves) figure 2. safe operating area figure 3. derating curve figure 4. output characteristics figure 5. reverse biased safe operating area figure 6. dc current gain figure 7. dc current gain
stbv32 electrical characteristics 5/11 figure 8. collector-emitter saturation voltage figure 9. base-emitter saturation voltage figure 10. inductive load switching time figure 11. resistive load switching time
electrical characteristics stbv32 6/11 2.2 test circuits figure 12. resistive load switching test circuit figure 13. inductive load switching test circuit 1) fast electronic switch 2) non-inductive resistor 1) fast electronic switch 2) non-inductive resistor 3) fast recovery rectifier
stbv32 package mechanical data 7/11 3 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
package mechanical data stbv32 8/11 dim. mm. min. typ max. a4. 3 24. 9 5 b 0. 3 6 0.51 d 4.45 4. 9 5 e 3 . 3 0 3 . 9 4 e 2.41 2.67 e1 1.14 1.40 l 12.70 15.4 9 r 2.16 2.41 s 10. 9 2 1.52 w 0.41 0.56 v5 o to-92 bulk s hipment mechanical data 01027 8 2 d
stbv32 package mechanical data 9/11 dim. mm min typ max a1 4. 8 0 t 3 . 8 0 t1 1.60 t2 2. 3 0 d 0.4 8 p0 12.50 12.70 12. 9 0 p2 5.65 6. 3 5 7.05 f1,f2 2.44 2.54 2. 9 4 f 3 4. 98 5.0 8 5.4 8 delt a h -2.00 2.00 w17.50 1 8 .00 1 9 .00 w0 5.70 6.00 6. 3 0 w1 8 .50 9 .00 9 .25 w2 0.50 h1 8 .50 20.50 h 3 0.5 1 1.5 h0 15.50 16.00 16.50 h1 25.00 d0 3 . 8 04.004.20 t 0. 9 0 l 11.00 i1 3 .00 delt a p -1.00 1.00 to-92 ammopack s hipment ( s uffix?-ap?) mechanical data 0050 9 10 s
revision history stbv32 10/11 4 revision history table 5. document revision history date revision changes 02-jul-2008 8 added halogen-free molding compound package.
stbv32 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at an y time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, an y liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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